Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
October 23, 2018
Patent Application Number
15262788
Date Filed
September 12, 2016
Patent Citations Received
...
Patent Primary Examiner
Patent abstract
A system and method for stacking semiconductor devices in three dimensions is provided. In an embodiment two or more semiconductor dies are attached to a carrier and encapsulated. Connections of the two or more semiconductor dies are exposed, and the two or more semiconductor dies may be thinned to form connections on an opposite side. Additional semiconductor dies may then be placed in either an offset or overhanging position.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
