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US Patent 10109613 3DIC stacking device and method of manufacture

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US Patent 12113005 Packages with Si-substrate-free interposer and method forming same
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Patent abstract

A system and method for stacking semiconductor devices in three dimensions is provided. In an embodiment two or more semiconductor dies are attached to a carrier and encapsulated. Connections of the two or more semiconductor dies are exposed, and the two or more semiconductor dies may be thinned to form connections on an opposite side. Additional semiconductor dies may then be placed in either an offset or overhanging position.

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US Patent 11774675 Semiconductor device and manufacturing method thereof
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US Patent 11769718 Packages with Si-substrate-free interposer and method forming same
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US Patent 11610858 Packages with Si-substrate-free interposer and method forming same
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Infobox
Is a
Patent
Patent
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
0
Patent Number
101096130
Date of Patent
October 23, 2018
0
Patent Application Number
152627880
Date Filed
September 12, 2016
0
Patent Citations Received
‌
US Patent 10490540 Multi-stack package-on-package structures
0
‌
US Patent 10522449 Packages with Si-substrate-free interposer and method forming same
0
‌
US Patent 10685910 Packages with Si-substrate-free interposer and method forming same
0
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US Patent 10748841 Packages with Si-substrate-free interposer and method forming same
0
‌
US Patent 10784248 Multi-stack package-on-package structures
0
‌
US Patent 10854568 Packages with Si-substrate-free interposer and method forming same
0
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US Patent 10971443 Packages with Si-substrate-free interposer and method forming same
0
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US Patent 11462530 Multi-stack package-on-package structures
0
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US Patent 11462531 Multi-stack package-on-package structures
0
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US Patent 11469166 Packages with Si-substrate-free interposer and method forming same
0
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US Patent 11527465 Packages with Si-substrate-free interposer and method forming same
0
Patent Primary Examiner
‌
Ismail Muse
0
Edits on 14 Dec, 2022
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Golden AI
edited on 14 Dec, 2022
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Infobox (+1 properties)
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Patent Citations Received
‌
US Patent 11527465 Packages with Si-substrate-free interposer and method forming same
0
Edits on 12 Oct, 2022
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Golden AI
edited on 12 Oct, 2022
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Infobox (+1 properties)
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Patent Citations Received
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US Patent 11469166 Packages with Si-substrate-free interposer and method forming same
0
Edits on 8 Oct, 2022
"update inverses"
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Golden AI
edited on 8 Oct, 2022
Edits made to:
Infobox (+1 properties)
Infobox
Patent Citations Received
‌
US Patent 11462531 Multi-stack package-on-package structures
0
"update inverses"
Golden AI profile picture
Golden AI
edited on 8 Oct, 2022
Edits made to:
Infobox (+1 properties)
Infobox
Patent Citations Received
‌
US Patent 11462530 Multi-stack package-on-package structures
0
Edits on 26 Sep, 2022
"update citations for inverse infoboxes"
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Golden AI
edited on 26 Sep, 2022
Edits on 26 Sep, 2022
"Entity importer update"
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Golden AI
edited on 26 Sep, 2022
Infobox
Is a
Patent
Patent
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
0
Patent Number
101096130
Date of Patent
October 23, 2018
0
Patent Application Number
152627880
Date Filed
September 12, 2016
0
Patent Citations Received
‌
US Patent 10490540 Multi-stack package-on-package structures
0
‌
US Patent 10522449 Packages with Si-substrate-free interposer and method forming same
0
‌
US Patent 10685910 Packages with Si-substrate-free interposer and method forming same
0
‌
US Patent 10748841 Packages with Si-substrate-free interposer and method forming same
0
‌
US Patent 10784248 Multi-stack package-on-package structures
0
‌
US Patent 10854568 Packages with Si-substrate-free interposer and method forming same
0
‌
US Patent 10971443 Packages with Si-substrate-free interposer and method forming same
0
Patent Primary Examiner
‌
Ismail Muse
0
"update citations for inverse infoboxes"
Golden AI profile picture
Golden AI
edited on 26 Sep, 2022
Edits on 23 Sep, 2022
"update citations for inverse infoboxes"
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Golden AI
edited on 23 Sep, 2022

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