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US Patent 10109613 3DIC stacking device and method of manufacture

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
Date Filed
September 12, 2016
Date of Patent
October 23, 2018
Patent Application Number
15262788
Patent Citations Received
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US Patent 12113005 Packages with Si-substrate-free interposer and method forming same
0
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US Patent 11462531 Multi-stack package-on-package structures
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US Patent 11469166 Packages with Si-substrate-free interposer and method forming same
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US Patent 11769718 Packages with Si-substrate-free interposer and method forming same
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US Patent 11774675 Semiconductor device and manufacturing method thereof
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US Patent 11462530 Multi-stack package-on-package structures
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US Patent 10490540 Multi-stack package-on-package structures
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US Patent 10522449 Packages with Si-substrate-free interposer and method forming same
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US Patent 11527465 Packages with Si-substrate-free interposer and method forming same
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US Patent 10685910 Packages with Si-substrate-free interposer and method forming same
•••
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
10109613
Patent Primary Examiner
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Ismail Muse

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