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US Patent 10707145 High density multi-component packages

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Patent attributes

Patent Applicant

Kemet Electronics Corporation

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Patent Jurisdiction

United States Patent and Trademark Office

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Patent Number

Date of Patent

July 7, 2020

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Patent Application Number

158045150

Date Filed

November 6, 2017

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Patent Citations Received

US Patent 12113056 Stacked dies and methods for forming bonded structures

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US Patent 12068278 Processed stacked dies

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US Patent 12080672 Direct gang bonding methods including directly bonding first element to second element to form bonded structure without adhesive

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US Patent 11652083 Processed stacked dies

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US Patent 11658173 Stacked dies and methods for forming bonded structures

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US Patent 11764189 Molded direct bonded and interconnected stack

US Patent 11837596 Stacked dies and methods for forming bonded structures

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Patent Primary Examiner

Nathan Milakovich

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