Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Rajesh Katkar
Belgacem Haba
Guilian Gao
Cyprian Emeka Uzoh
Jeremy Alfred Theil
Date of Patent
September 19, 2023
Patent Application Number
17448794
Date Filed
September 24, 2021
Patent Citations
...
Patent Citations Received
Patent Primary Examiner
Patent abstract
Dies and/or wafers are stacked and bonded in various arrangements including stacks, and may be covered with a molding to facilitate handling, packaging, and the like. In various examples, the molding may cover more or less of a stack, to facilitate connectivity with the devices of the stack, to enhance thermal management, and so forth.
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