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US Patent 8802538 Methods for hybrid wafer bonding

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Is a

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Patent attributes

Patent Jurisdiction

United States Patent and Trademark Office

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Patent Number

Patent Inventor Names

Hung-Hua Lin0

Xiaomeng Chen0

Xin-Hua Huang0

Chia-Shiung Tsai0

Jen-Cheng Liu0

Lan-Lin Chao0

Ping-Yin Liu0

Date of Patent

August 12, 2014

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Patent Application Number

139274770

Date Filed

June 26, 2013

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Patent Citations Received

US Patent 12136605 Layer structures for making direct metal-to-metal bonds at low temperatures in microelectronics and method for forming the same

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US Patent 12068278 Processed stacked dies

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US Patent 12074092 Hard IP blocks with physically bidirectional passageways

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US Patent 12080672 Direct gang bonding methods including directly bonding first element to second element to form bonded structure without adhesive

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US Patent 12113056 Stacked dies and methods for forming bonded structures

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