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US Patent 8802538 Methods for hybrid wafer bonding

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
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Date Filed
June 26, 2013
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Date of Patent
August 12, 2014
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Patent Application Number
13927477
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Patent Citations Received
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US Patent 12136605 Layer structures for making direct metal-to-metal bonds at low temperatures in microelectronics and method for forming the same
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US Patent 12068278 Processed stacked dies
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US Patent 12074092 Hard IP blocks with physically bidirectional passageways
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US Patent 12080672 Direct gang bonding methods including directly bonding first element to second element to form bonded structure without adhesive
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US Patent 12113056 Stacked dies and methods for forming bonded structures
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US Patent 12113054 Non-volatile dynamic random access memory
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US Patent 12125784 Interconnect structures
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US Patent 12132020 Low temperature bonded structures
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US Patent 11658173 Stacked dies and methods for forming bonded structures
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US Patent 11664357 Techniques for joining dissimilar materials in microelectronics
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•••
Patent Inventor Names
Hung-Hua Lin
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Xiaomeng Chen
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Xin-Hua Huang
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Chia-Shiung Tsai
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Jen-Cheng Liu
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Lan-Lin Chao
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Ping-Yin Liu
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
8802538
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Patent Primary Examiner
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Cheung Lee
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