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US Patent 10716207 Printed circuit board and integrated circuit package

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Official Website
https://pdfpiw.uspto.gov/.piw?Docid=1071620700
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Website URL
https://pdfpiw.uspto.gov/.piw?Docid=10716207
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 US Patent 10716207 Printed circuit board and integrated circuit package

Infobox
Is a
Patent
Patent
Patent applicant
Innovium
Innovium
Current assignee
Innovium
Innovium
Patent jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent number
10716207
Date of patent
July 14, 2020
Patent application number
16112066
Date Filed
August 24, 2018
Patent citations
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US Patent 10091873 Printed circuit board and integrated circuit package
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US Patent 10187972 Backplane footprint for high speed, high density electrical connectors
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US Patent 10244629 Printed circuit board including multi-diameter vias
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US Patent 10251270 Dual-drill printed circuit board via
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US Patent 10292257 Cross-talk reduction for high speed signaling at ball grid array region and connector region
Patent primary examiner
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Earl N Taylor

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