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US Patent 10716207 Printed circuit board and integrated circuit package
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Patent
Current Assignee
Innovium
Date Filed
August 24, 2018
Date of Patent
July 14, 2020
Patent Applicant
Innovium
Patent Application Number
16112066
Patent Citations
US Patent 10251270 Dual-drill printed circuit board via
US Patent 10091873 Printed circuit board and integrated circuit package
US Patent 10187972 Backplane footprint for high speed, high density electrical connectors
US Patent 10244629 Printed circuit board including multi-diameter vias
US Patent 10292257 Cross-talk reduction for high speed signaling at ball grid array region and connector region
Patent Jurisdiction
United States Patent and Trademark Office
Patent Number
10716207
Patent Primary Examiner
Earl N Taylor
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