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US Patent 10741500 Electronic package
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Patent
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Date Filed
May 4, 2018
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Date of Patent
August 11, 2020
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Patent Application Number
15971534
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Patent Citations
US Patent 10026716 3DIC formation with dies bonded to formed RDLs
Patent Citations Received
US Patent 11631626 Package structure
0
US Patent 11398429 Electronic package and manufacturing method thereof
Patent Jurisdiction
United States Patent and Trademark Office
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Patent Number
10741500
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Patent Primary Examiner
Shouxiang Hu
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