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US Patent 10784248 Multi-stack package-on-package structures

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Golden AI
edited on 6 Nov, 2024
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Patent Citations Received
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US Patent 12136597 Semiconductor package having an interposer in which one or more dies are formed and method of forming the same
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Edits on 5 Oct, 2023
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Golden AI
edited on 5 Oct, 2023
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Patent Citations Received
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US Patent 11774675 Semiconductor device and manufacturing method thereof
Edits on 7 Sep, 2023
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edited on 7 Sep, 2023
Edits on 19 May, 2023
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edited on 19 May, 2023
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Official Website
https://pdfpiw.uspto.gov/.piw?Docid=1078424800
Edits on 17 May, 2023
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edited on 17 May, 2023
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Patent Citations Received
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US Patent 11651132 Logic drive based on standard commodity FPGA IC chips
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Edits on 30 Apr, 2023
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edited on 30 Apr, 2023
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Patent Citations Received
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US Patent 11637056 3D chip package based on through-silicon-via interconnection elevator
0
Edits on 12 Apr, 2023
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Golden AI
edited on 12 Apr, 2023
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Patent Citations Received
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US Patent 11625523 Logic drive based on standard commodity FPGA IC chips
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Edits on 5 Apr, 2023
"Entity importer update"
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edited on 5 Apr, 2023
Infobox
Is a
Patent
Patent
0
Patent Applicant
Taiwan Semiconductor Manufacturing Company
Taiwan Semiconductor Manufacturing Company
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
0
Patent Number
107842480
Date of Patent
September 22, 2020
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Patent Application Number
165909920
Date Filed
October 2, 2019
0
Official Website
https://pdfpiw.uspto.gov/.piw?Docid=107842480
Patent Citations
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US Patent 10109613 3DIC stacking device and method of manufacture
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Patent Citations Received
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US Patent 11309334 Logic drive using standard commodity programmable logic IC chips comprising non-volatile random access memory cells
0
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US Patent 11368157 Logic drive with brain-like elasticity and integrality based on standard commodity FPGA IC chips using non-volatile memory cells
0
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US Patent 11394386 Logic drive using standard commodity programmable logic IC chips
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US Patent 11545477 Logic drive based on standardized commodity programmable logic semiconductor IC chips
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US Patent 11600526 Chip package based on through-silicon-via connector and silicon interconnection bridge
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Patent Primary Examiner
‌
Nitin Parekh
0
Edits on 26 Mar, 2023
"update citations for inverse infoboxes"
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edited on 26 Mar, 2023
Edits on 8 Mar, 2023
"update inverses"
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Golden AI
edited on 8 Mar, 2023
Edits made to:
Infobox (+1 properties)
Infobox
Patent Citations Received
‌
US Patent 11600526 Chip package based on through-silicon-via connector and silicon interconnection bridge
0
Edits on 4 Jan, 2023
"update inverses"
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Golden AI
edited on 4 Jan, 2023
Edits made to:
Infobox (+1 properties)
Infobox
Patent Citations Received
‌
US Patent 11545477 Logic drive based on standardized commodity programmable logic semiconductor IC chips
0
Edits on 26 Sep, 2022
"update citations for inverse infoboxes"
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Golden AI
edited on 26 Sep, 2022
"update citations for inverse infoboxes"
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Golden AI
edited on 26 Sep, 2022
"Entity importer update"
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edited on 26 Sep, 2022
Infobox
Is a
Patent
Patent
0
Patent Applicant
Taiwan Semiconductor Manufacturing Company
Taiwan Semiconductor Manufacturing Company
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
0
Patent Number
107842480
Date of Patent
September 22, 2020
0
Patent Application Number
165909920
Date Filed
October 2, 2019
0
Official Website
https://pdfpiw.uspto.gov/.piw?Docid=107842480
Patent Citations
‌
US Patent 10109613 3DIC stacking device and method of manufacture
0
Patent Citations Received
‌
US Patent 11309334 Logic drive using standard commodity programmable logic IC chips comprising non-volatile random access memory cells
0
‌
US Patent 11368157 Logic drive with brain-like elasticity and integrality based on standard commodity FPGA IC chips using non-volatile memory cells
0
‌
US Patent 11394386 Logic drive using standard commodity programmable logic IC chips
0
Patent Primary Examiner
‌
Nitin Parekh
0
Edits on 23 Sep, 2022
"update citations for inverse infoboxes"
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edited on 23 Sep, 2022
Edits on 20 Jul, 2022
"update inverses"
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Golden AI
edited on 20 Jul, 2022
Edits made to:
Infobox (+1 properties)
Infobox
Patent citations received
‌
US Patent 11394386 Logic drive using standard commodity programmable logic IC chips
Edits on 22 Jun, 2022
"update inverses"
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Golden AI
edited on 22 Jun, 2022
Edits on 8 Jun, 2022
"Entity importer update"
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Golden AI
edited on 8 Jun, 2022
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Infobox
Website URL
https://pdfpiw.uspto.gov/.piw?Docid=10784248
Edits on 18 May, 2022
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edited on 18 May, 2022
Edits on 6 Feb, 2022
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created this topic on 6 Feb, 2022
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 US Patent 10784248 Multi-stack package-on-package structures

Infobox
Is a
Patent
Patent
Patent applicant
Taiwan Semiconductor Manufacturing Company
Taiwan Semiconductor Manufacturing Company
Patent jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent number
10784248
Date of patent
September 22, 2020
Patent application number
16590992
Date Filed
October 2, 2019
Patent citations
‌
US Patent 10109613 3DIC stacking device and method of manufacture
Patent primary examiner
‌
Nitin Parekh

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