US Patent 10784248 Multi-stack package-on-package structures

Patent

Taiwan Semiconductor Manufacturing Company

US Patent 10109613 3DIC stacking device and method of manufacture

US Patent 12136597 Semiconductor package having an interposer in which one or more dies are formed and method of forming the same

US Patent 11368157 Logic drive with brain-like elasticity and integrality based on standard commodity FPGA IC chips using non-volatile memory cells

US Patent 11394386 Logic drive using standard commodity programmable logic IC chips

US Patent 11545477 Logic drive based on standardized commodity programmable logic semiconductor IC chips

US Patent 11600526 Chip package based on through-silicon-via connector and silicon interconnection bridge

US Patent 11625523 Logic drive based on standard commodity FPGA IC chips

US Patent 11637056 3D chip package based on through-silicon-via interconnection elevator

US Patent 11651132 Logic drive based on standard commodity FPGA IC chips

US Patent 11749610 Logic drive based on chip scale package comprising standardized commodity programmable logic IC chip and memory IC chip

US Patent 11309334 Logic drive using standard commodity programmable logic IC chips comprising non-volatile random access memory cells

United States Patent and Trademark Office

Nitin Parekh