US Patent 10788367 Integrated circuit using photonic bandgap structure

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Is a

Patent

Patent attributes

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

107883670

Date of Patent

September 29, 2020

Patent Application Number

167155310

Date Filed

December 16, 2019

Patent Citations

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US Patent 10444432 Galvanic signal path isolation in an encapsulated package using a photonic structure

‌

US Patent 10139564 Vertically integrated optoelectronics package for MEMS devices

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US Patent 10062583 Microelectronics package with inductive element and magnetically enhanced mold compound component

Patent Citations Received

‌

US Patent 11657684 Temperature indicator for optical module

Patent Primary Examiner

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Richard A Booth

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