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US Patent 10788367 Integrated circuit using photonic bandgap structure

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
0
Date Filed
December 16, 2019
0
Date of Patent
September 29, 2020
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Patent Application Number
16715531
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Patent Citations
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US Patent 10444432 Galvanic signal path isolation in an encapsulated package using a photonic structure
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US Patent 10139564 Vertically integrated optoelectronics package for MEMS devices
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US Patent 10062583 Microelectronics package with inductive element and magnetically enhanced mold compound component
Patent Citations Received
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US Patent 11657684 Temperature indicator for optical module
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
10788367
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Patent Primary Examiner
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Richard A Booth
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