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US Patent 10867978 Integrated circuit module with integrated discrete devices
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Edits on 5 Jul, 2023
"update inverses"
Golden AI
edited on 5 Jul, 2023
Edits made to:
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properties)
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Patent Citations Received
US Patent 11694966 Chip package and method of forming the same
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Edits on 24 May, 2023
"Remove website redirecting to Patent Public Search front page"
Golden AI
edited on 24 May, 2023
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Official Website
https://pdfpiw.uspto.gov/.piw?Docid=10867978
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Edits on 29 Apr, 2023
"update citations for inverse infoboxes"
Golden AI
edited on 29 Apr, 2023
Infobox
Patent Citations
US Patent 10510721 Molded chip combination
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Edits on 28 Mar, 2023
"update citations for inverse infoboxes"
Golden AI
edited on 28 Mar, 2023
Infobox
Patent Citations
US Patent 10267990 Hybrid interconnect device and method
0
Edits on 26 Sep, 2022
"Entity importer update"
Golden AI
edited on 26 Sep, 2022
Infobox
Is a
Patent
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Patent Applicant
Advanced Micro Devices
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Current Assignee
Advanced Micro Devices
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Patent Jurisdiction
United States Patent and Trademark Office
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Patent Number
10867978
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Date of Patent
December 15, 2020
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Patent Application Number
16215969
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Date Filed
December 11, 2018
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Official Website
https://pdfpiw.uspto.gov/.piw?Docid=10867978
0
Patent Citations
US Patent 10267990 Hybrid interconnect device and method
0
US Patent 10510721 Molded chip combination
0
Patent Primary Examiner
Nduka E Ojeh
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Edits on 22 Sep, 2022
"update citations for inverse infoboxes"
Golden AI
edited on 22 Sep, 2022
Infobox
Patent Citations
US Patent 10510721 Molded chip combination
0
Edits on 17 Jun, 2022
"Entity importer update"
Golden AI
edited on 17 Jun, 2022
Edits made to:
Infobox
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+1
properties)
Infobox
Website URL
https://pdfpiw.uspto.gov/.piw?Docid=10867978
Edits on 8 Feb, 2022
"Created via: Entity Importer"
Golden AI
created this topic on 8 Feb, 2022
Edits made to:
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+11
properties)
US Patent 10867978 Integrated circuit module with integrated discrete devices
Infobox
Is a
Patent
Patent applicant
Advanced Micro Devices
Current assignee
Advanced Micro Devices
Patent jurisdiction
United States Patent and Trademark Office
Patent number
10867978
Date of patent
December 15, 2020
Patent application number
16215969
Date Filed
December 11, 2018
Patent citations
US Patent 10267990 Hybrid interconnect device and method
US Patent 10510721 Molded chip combination
Patent primary examiner
Nduka E Ojeh
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