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US Patent 10867978 Integrated circuit module with integrated discrete devices
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Patent
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Current Assignee
Advanced Micro Devices
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Date Filed
December 11, 2018
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Date of Patent
December 15, 2020
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Patent Applicant
Advanced Micro Devices
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Patent Application Number
16215969
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Patent Citations
US Patent 10267990 Hybrid interconnect device and method
US Patent 10510721 Molded chip combination
Patent Citations Received
US Patent 11694966 Chip package and method of forming the same
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Patent Jurisdiction
United States Patent and Trademark Office
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Patent Number
10867978
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Patent Primary Examiner
Nduka E Ojeh
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