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US Patent 10877229 Edge coupling through unetched surface of photonic chip

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Edits on 26 Jun, 2024
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edited on 26 Jun, 2024
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Patent Citations Received
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US Patent 12019286 Optical edge coupler having a heterogeneous cladding structure
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Edits on 28 Dec, 2023
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edited on 28 Dec, 2023
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Patent Citations Received
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US Patent 11853870 Photonic semiconductor devices and methods for manufacturing the same
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Edits on 18 Oct, 2023
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edited on 18 Oct, 2023
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Patent Citations Received
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US Patent 11788929 Techniques for wafer level die testing using sacrificial structures
Edits on 21 May, 2023
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edited on 21 May, 2023
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Official Website
https://pdfpiw.uspto.gov/.piw?Docid=108772290
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Infobox
Is a
Patent
Patent
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
0
Patent Number
108772290
Date of Patent
December 29, 2020
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Patent Application Number
164218010
Date Filed
May 24, 2019
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Official Website
https://pdfpiw.uspto.gov/.piw?Docid=108772290
Patent Citations
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US Patent 10054745 Photonic integration platform
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US Patent 10145758 Wafer level optical probing structures for silicon photonics
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Patent Primary Examiner
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John Bedtelyon
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Edits on 31 Mar, 2023
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edited on 31 Mar, 2023
Edits on 26 Sep, 2022
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edited on 26 Sep, 2022
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edited on 17 Jun, 2022
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Website URL
https://pdfpiw.uspto.gov/.piw?Docid=10877229
Edits on 9 Feb, 2022
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 US Patent 10877229 Edge coupling through unetched surface of photonic chip

Infobox
Is a
Patent
Patent
Patent jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent number
10877229
Date of patent
December 29, 2020
Patent application number
16421801
Date Filed
May 24, 2019
Patent citations
‌
US Patent 10054745 Photonic integration platform
‌
US Patent 10145758 Wafer level optical probing structures for silicon photonics
Patent primary examiner
‌
John Bedtelyon

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