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US Patent 10877229 Edge coupling through unetched surface of photonic chip
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Patent
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Date Filed
May 24, 2019
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Date of Patent
December 29, 2020
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Patent Application Number
16421801
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Patent Citations
US Patent 10054745 Photonic integration platform
US Patent 10145758 Wafer level optical probing structures for silicon photonics
Patent Citations Received
US Patent 12019286 Optical edge coupler having a heterogeneous cladding structure
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US Patent 11788929 Techniques for wafer level die testing using sacrificial structures
US Patent 11853870 Photonic semiconductor devices and methods for manufacturing the same
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Patent Jurisdiction
United States Patent and Trademark Office
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Patent Number
10877229
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Patent Primary Examiner
John Bedtelyon
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