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US Patent 10879162 Integrated fan-out packages
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All edits
Edits on 23 May, 2023
"Remove website redirecting to Patent Public Search front page"
Golden AI
edited on 23 May, 2023
Edits made to:
Infobox
(
-1
properties)
Infobox
Official Website
https://pdfpiw.uspto.gov/.piw?Docid=10879162
0
0
Edits on 28 Apr, 2023
"update citations for inverse infoboxes"
Golden AI
edited on 28 Apr, 2023
Infobox
Patent Citations
US Patent 10163824 Integrated fan-out package and method of fabricating the same
0
Edits on 25 Apr, 2023
"Entity importer update"
Golden AI
edited on 25 Apr, 2023
Infobox
Is a
Patent
0
Current Assignee
Taiwan Semiconductor Manufacturing Company
0
Patent Jurisdiction
United States Patent and Trademark Office
0
Patent Number
10879162
0
Date of Patent
December 29, 2020
0
Patent Application Number
16504324
0
Date Filed
July 7, 2019
0
Official Website
https://pdfpiw.uspto.gov/.piw?Docid=10879162
0
Patent Citations
US Patent 10163824 Integrated fan-out package and method of fabricating the same
0
US Patent 10319608 Package structure and method therof
0
US Patent 10475747 Integrated fan-out package and method for fabricating the same
0
US Patent 10522451 Fan-out semiconductor package
0
Patent Primary Examiner
Ida M. Soward
0
Edits on 23 Apr, 2023
"update citations for inverse infoboxes"
Golden AI
edited on 23 Apr, 2023
Infobox
Patent Citations
US Patent 10522451 Fan-out semiconductor package
0
Edits on 25 Mar, 2023
"update citations for inverse infoboxes"
Golden AI
edited on 25 Mar, 2023
Infobox
Patent Citations
US Patent 10319608 Package structure and method therof
0
Edits on 28 Sep, 2022
"update citations for inverse infoboxes"
Golden AI
edited on 28 Sep, 2022
Infobox
Patent Citations
US Patent 10163824 Integrated fan-out package and method of fabricating the same
0
Edits on 25 Sep, 2022
"Entity importer update"
Golden AI
edited on 25 Sep, 2022
Infobox
Is a
Patent
0
Current Assignee
Taiwan Semiconductor Manufacturing Company
0
Patent Jurisdiction
United States Patent and Trademark Office
0
Patent Number
10879162
0
Date of Patent
December 29, 2020
0
Patent Application Number
16504324
0
Date Filed
July 7, 2019
0
Official Website
https://pdfpiw.uspto.gov/.piw?Docid=10879162
0
Patent Citations
US Patent 10163824 Integrated fan-out package and method of fabricating the same
0
US Patent 10319608 Package structure and method therof
0
US Patent 10475747 Integrated fan-out package and method for fabricating the same
0
US Patent 10522451 Fan-out semiconductor package
0
Patent Primary Examiner
Ida M. Soward
0
"update citations for inverse infoboxes"
Golden AI
edited on 25 Sep, 2022
Infobox
Patent Citations
US Patent 10319608 Package structure and method therof
0
Edits on 17 Jun, 2022
"Entity importer update"
Golden AI
edited on 17 Jun, 2022
Edits made to:
Infobox
(
+1
properties)
Infobox
Website URL
https://pdfpiw.uspto.gov/.piw?Docid=10879162
Edits on 9 Feb, 2022
"Created via: Entity Importer"
Golden AI
created this topic on 9 Feb, 2022
Edits made to:
Infobox
(
+12
properties)
US Patent 10879162 Integrated fan-out packages
Infobox
Is a
Patent
Current assignee
Taiwan Semiconductor Manufacturing Company
Patent jurisdiction
United States Patent and Trademark Office
Patent number
10879162
Date of patent
December 29, 2020
Patent application number
16504324
Date Filed
July 7, 2019
Patent citations
US Patent 10163824 Integrated fan-out package and method of fabricating the same
US Patent 10319608 Package structure and method therof
US Patent 10475747 Integrated fan-out package and method for fabricating the same
US Patent 10522451 Fan-out semiconductor package
Patent primary examiner
Ida M. Soward
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