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US Patent 10879162 Integrated fan-out packages

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
Current Assignee
Taiwan Semiconductor Manufacturing Company
Taiwan Semiconductor Manufacturing Company
Date Filed
July 7, 2019
Date of Patent
December 29, 2020
Patent Application Number
16504324
Patent Citations
‌
US Patent 10319608 Package structure and method therof
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US Patent 10522451 Fan-out semiconductor package
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US Patent 10163824 Integrated fan-out package and method of fabricating the same
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US Patent 10475747 Integrated fan-out package and method for fabricating the same
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
10879162
Patent Primary Examiner
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Ida M. Soward

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