Patent attributes
Example embodiments relate to interconnect structures and related methods. One embodiment includes an interconnect structure. The interconnect structure includes a first interconnection level including a first dielectric layer and a first set of conductive paths. The interconnect structure also includes a second interconnection level arranged above the first interconnection level and including a second dielectric layer and a second set of conductive paths. Further, the interconnect structure includes a third interconnection level arranged above the second interconnection level and including a third dielectric layer and a third set of conductive paths. In addition, the interconnect structure includes a fourth interconnection level arranged above the third interconnection level and including a fourth dielectric layer and a fourth set of conductive paths. Still further, the interconnect structure includes a first multi-level via structure and a second multi-level via structure.
