US Patent 10886215 Interconnect structure and related methods
Patent 10886215 was granted and assigned to IMEC on January, 2021 by the United States Patent and Trademark Office.
Is a
Current Assignee
0
Date Filed
July 24, 2019
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Date of Patent
January 5, 2021
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Patent Applicant
0
Patent Application Number
16521127
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Patent Citations
Patent Inventor Names
Victoria L. Calero Diaz Del Castillo
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Christian Witt
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Houman Zahedmanesh
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Patent Jurisdiction
Patent Number
Patent Primary Examiner
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