Log in
Sign up
Golden has been acquired by ComplyAdvantage.Read about it here ⟶
‌

US Patent 10892235 Die seal ring and manufacturing method thereof

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
Date Filed
September 19, 2018
Date of Patent
January 12, 2021
Patent Application Number
16135997
Patent Citations
‌
US Patent 10276498 Interconnect structure with air-gaps
‌
US Patent 10366993 Semiconductor structure having air gap between gate electrode and distal end portion of active area
‌
US Patent 10388567 Thru-silicon-via structures
‌
US Patent 10388770 Gate and source/drain contact structures positioned above an active region of a transistor device
‌
US Patent 10395988 Vertical FET transistor with reduced source/drain contact resistance
‌
US Patent 10418275 Methods of sealing openings, and methods of forming integrated assemblies
‌
US Patent 10522642 Semiconductor device with air-spacer
‌
US Patent 10573724 Contact over active gate employing a stacked spacer
‌
US Patent 10535603 Method of forming interconnection structure
‌
US Patent 10665499 Integrated circuit with airgaps to control capacitance
•••
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
10892235
Patent Primary Examiner
‌
Maliheh Malek

Find more entities like US Patent 10892235 Die seal ring and manufacturing method thereof

Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
Open Query Tool
Access by API
Golden Query Tool
Golden logo