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US Patent 11056411 Chip packaging structure

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
0
Date Filed
April 30, 2019
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Date of Patent
July 6, 2021
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Patent Applicant
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Hon Hai Precision Industry Co Ltd
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Patent Application Number
16398746
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Patent Citations
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US Patent 10381312 Semiconductor package and method of manufacturing the same
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US Patent 10515922 Multi-chip integrated fan-out package
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US Patent 10566320 Method for fabricating electronic package
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US Patent 10714403 Semiconductor device package with patterned conductive layers and an interconnecting structure
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US Patent 10796970 Method for fabricating electronic package
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US Patent 10879224 Package structure, die and method of manufacturing the same
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US Patent 10797025 Advanced INFO POP and method of forming thereof
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US Patent 10096563 Semiconductor package and method of forming the same
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US Patent 10115674 Semiconductor device including electromagnetic interference (EMI) shielding layer and method for manufacturing the semiconductor device
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US Patent 10276508 Semiconductor packages and methods of forming the same
•••
Patent Inventor Names
Young-Way Liu
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Ching-Yu Ni
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Hsiang-Hua Lu
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
11056411
0
Patent Primary Examiner
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Ida M. Soward
0

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