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US Patent 11064609 Printable 3D electronic structure

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
0
Date Filed
August 3, 2017
0
Date of Patent
July 13, 2021
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Patent Application Number
15668460
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Patent Citations
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US Patent 10037985 Compound micro-transfer-printed power transistor device
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US Patent 10103069 Pressure-activated electrical interconnection by micro-transfer printing
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US Patent 10223962 Display with fused LEDs
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US Patent 10153256 Micro-transfer printable electronic component
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US Patent 10468391 Inorganic light-emitting-diode displays with multi-ILED pixels
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US Patent 10750614 Deformable electrical contacts with conformable target pads
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US Patent 10475876 Devices with a single metal layer
Patent Citations Received
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US Patent 11399434 Electronic package and method of forming an electronic package
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US Patent 11552034 Chiplets with connection posts
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US Patent 11276657 Chiplets with connection posts
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US Patent 11495560 Chiplets with connection posts
Patent Inventor Names
Ronald S. Cok
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
0
Patent Number
11064609
0
Patent Primary Examiner
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Nathan Milakovich
0

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