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US Patent 11064626 Densely packed electronic systems
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Patent
Date Filed
October 14, 2020
Date of Patent
July 13, 2021
Patent Application Number
17070818
Patent Citations
US Patent 10461009 3DIC packaging with hot spot thermal management features
US Patent 10249503 Printed circuit board, semiconductor package and method of manufacturing the same
US Patent 10336599 Cover for a water cooler reservoir bottle
US Patent 10039210 Integrated thermal inserts and cold plate
Patent Citations Received
US Patent 12136576 Microelectronic module
0
US Patent 11523543 Water cooled server
US Patent 11546991 Densely packed electronic systems
US Patent 11393807 Densely packed electronic systems
US Patent 11445640 Water cooled server
US Patent 11516948 Immersion cooling systems and methods for electrical power components
Patent Jurisdiction
United States Patent and Trademark Office
Patent Number
11064626
Patent Primary Examiner
Courtney L Smith
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