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US Patent 11069640 Package for power electronics

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
0
Date Filed
June 14, 2019
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Date of Patent
July 20, 2021
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Patent Application Number
16441925
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Patent Citations
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US Patent 10141254 Direct bonded copper power module with elevated common source inductance
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US Patent 10265212 Set of occlusal splints and method of making same
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US Patent 10700681 Paralleled power module with additional emitter/source path
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US Patent 10389265 Module, and power conversion apparatus and motor using the module
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US Patent 10720914 Semiconductor device and semiconductor package
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US Patent 10720913 Integrated failsafe pulldown circuit for GaN switch
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US Patent 10084442 Semiconductor device
Patent Citations Received
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US Patent 12087680 Power module having an elevated power plane with an integrated signal board and process of implementing the same
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US Patent 11756910 Package for power electronics
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US Patent 11887953 Package for power electronics
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US Patent 11574859 Power module having an elevated power plane with an integrated signal board and process of implementing the same
Patent Inventor Names
Jennifer Stabach
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Brice McPherson
0
Daniel Martin
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
0
Patent Number
11069640
0
Patent Primary Examiner
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David A Zarneke
0

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