Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Hung-Sheng Han0
Yu-Bin Chen0
Date of Patent
August 3, 2021
0Patent Application Number
201902220
Date Filed
February 22, 2019
0Patent Citations Received
Patent abstract
A radiative cooling substrate and a manufacturing method of the radiative cooling substrate are provided. The radiative cooling substrate includes a metallic substrate and a chitosan layer disposed on the metallic substrate with a thickness of 0.5 μm to 10 μm. The chitosan layer emits radiation within a waveband between 8 μm and 13 μm.
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