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US Patent 11078593 Radiative cooling substrate and manufacturing method of the same

Patent 11078593 was granted and assigned to National Tsing Hua University on August, 2021 by the United States Patent and Trademark Office.

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Edits on 12 Dec, 2023
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edited on 12 Dec, 2023
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Patent abstract

A radiative cooling substrate and a manufacturing method of the radiative cooling substrate are provided. The radiative cooling substrate includes a metallic substrate and a chitosan layer disposed on the metallic substrate with a thickness of 0.5 μm to 10 μm. The chitosan layer emits radiation within a waveband between 8 μm and 13 μm.

Edits on 7 Dec, 2023
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Patent Citations Received
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US Patent 11835255 Cooling panel system
0
Edits on 10 Oct, 2023
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Patent Inventor Names
Hung-Sheng Han0
Yu-Bin Chen0
Edits on 21 May, 2023
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Official Website
https://pdfpiw.uspto.gov/.piw?Docid=110785930
Edits on 23 Apr, 2023
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edited on 23 Apr, 2023
Infobox
Is a
Patent
Patent
0
Patent Applicant
National Tsing Hua University
National Tsing Hua University
0
Current Assignee
National Tsing Hua University
National Tsing Hua University
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
0
Patent Number
110785930
Date of Patent
August 3, 2021
0
Patent Application Number
201902220
Date Filed
February 22, 2019
0
Official Website
https://pdfpiw.uspto.gov/.piw?Docid=110785930
Patent Citations Received
‌
US Patent 11359841 Radiative cooling systems
0
Edits on 23 Sep, 2022
"update citations for inverse infoboxes"
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edited on 23 Sep, 2022
Infobox
Patent Citations Received
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US Patent 11359841 Radiative cooling systems
0
Edits on 16 Jun, 2022
"update inverses"
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edited on 16 Jun, 2022
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Patent citations received
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US Patent 11359841 Radiative cooling systems
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Website URL
https://pdfpiw.uspto.gov/.piw?Docid=11078593
Edits on 8 Oct, 2021
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 US Patent 11078593 Radiative cooling substrate and manufacturing method of the same

Infobox
Is a
Patent
Patent
Patent applicant
National Tsing Hua University
National Tsing Hua University
Current assignee
National Tsing Hua University
National Tsing Hua University
Patent jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent number
11078593
Date of patent
August 3, 2021
Patent application number
20190222
Date Filed
February 22, 2019

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