US Patent 11103972 Buff processing device and substrate processing device

Patent 11103972 was granted and assigned to Ebara Corporation on August, 2021 by the United States Patent and Trademark Office.

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Patent

Patent attributes

Patent Applicant

Ebara Corporation

Current Assignee

Ebara Corporation

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

111039720

Patent Inventor Names

Naoki Toyomura0

Junji Kunisawa0

Mitsuru Miyazaki0

Hideo Aizawa0

Date of Patent

August 31, 2021

Patent Application Number

201610110

Date Filed

October 11, 2016

Patent abstract

In-plane uniformity of buff processing is improved. According to a first form, a buff processing device for executing buff processing of a substrate is provided. Such buff processing device has a rotatable shaft, a buff head body, a torque transmission mechanism for transmitting rotation of the shaft to the buff head body, and an elastic member for elastically supporting the buff head body in a longitudinal direction of the shaft.

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