US Patent 11103972 Buff processing device and substrate processing device
Patent 11103972 was granted and assigned to Ebara Corporation on August, 2021 by the United States Patent and Trademark Office.
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Patent abstract
In-plane uniformity of buff processing is improved. According to a first form, a buff processing device for executing buff processing of a substrate is provided. Such buff processing device has a rotatable shaft, a buff head body, a torque transmission mechanism for transmitting rotation of the shaft to the buff head body, and an elastic member for elastically supporting the buff head body in a longitudinal direction of the shaft.
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Patent Inventor Names
Hideo Aizawa0
Junji Kunisawa0
Mitsuru Miyazaki0
Naoki Toyomura0
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Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
111039720
Date of Patent
August 31, 2021
0Patent Application Number
201610110
Date Filed
October 11, 2016
0Official Website
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US Patent 11103972 Buff processing device and substrate processing device
Infobox
Is a
Patent applicant
Current assignee
Patent jurisdiction
Patent number
11103972
Date of patent
August 31, 2021
Patent application number
20161011
Date Filed
October 11, 2016
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