Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Laura Wills Mirkarimi0
Cyprian Emeka Uzoh0
Date of Patent
December 7, 2021
0Patent Application Number
161409950
Date Filed
September 25, 2018
0Patent Citations Received
0
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Patent Primary Examiner
Patent abstract
A method for forming an interconnect structure in an element is disclosed. The method can include patterning a cavity in a non-conductive material. The method can include exposing a surface of the cavity in the non-conductive material to a surface nitriding treatment. The method can include depositing a conductive material directly onto the treated surface after the exposing.
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