Patent 11221184 was granted and assigned to Ball Aerospace & Technologies on January, 2022 by the United States Patent and Trademark Office.
Heat transfer systems and methods are provided. The heat transfer system includes an evaporator section integrated with or thermally joined to a heat dissipating system. The evaporator section is connected to a condenser section by a conduit. Together, portions of the evaporator section, the condenser section, and the conduit form a closed volume containing a heat transfer fluid. A superhydrophobic surface is present on at least a portion of the condenser section forming a part of the closed volume. The superhydrophobic surface can include a plurality of carbon nanotubes. The carbon nanotubes can be provided as a forest of carbon nanotubes extending from a rough surface.