Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Shaowu Huang0
Guilian Gao0
Ilyas Mohammed0
Liang Wang0
Rajesh Katkar0
Cyprian Emeka Uzoh0
Date of Patent
February 22, 2022
Patent Application Number
16678037
Date Filed
November 8, 2019
Patent Citations
...
Patent Citations Received
Patent Primary Examiner
Patent abstract
Representative implementations of techniques and devices provide seals for sealing the joints of bonded microelectronic devices as well as bonded and sealed microelectronic assemblies. Seals are disposed at joined surfaces of stacked dies and wafers to seal the joined surfaces. The seals may be disposed at an exterior periphery of the bonded microelectronic devices or disposed within the periphery using the various techniques.
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