Log in
Sign up
Golden has been acquired by ComplyAdvantage.Read about it here ⟶
‌

US Patent 11257727 Seal for microelectronic assembly

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
Date Filed
November 8, 2019
Date of Patent
February 22, 2022
Patent Application Number
16678037
Patent Citations
‌
US Patent 10026605 Method of reducing residual contamination in singulated semiconductor die
0
‌
US Patent 10075657 Edgeless large area camera system
‌
US Patent 10204893 Stacked dies and methods for forming bonded structures
‌
US Patent 10269756 Die processing
0
‌
US Patent 10276619 Semiconductor device structure with a conductive feature passing through a passivation layer
‌
US Patent 10276909 Structure comprising at least a first element bonded to a carrier having a closed metallic channel waveguide formed therein
0
‌
US Patent 10446456 Integrated circuits protected by substrates with cavities, and methods of manufacture
0
‌
US Patent 10446487 Interface structures and methods for forming same
0
‌
US Patent 10446532 Systems and methods for efficient transfer of semiconductor elements
0
‌
US Patent 10508030 Seal for microelectronic assembly
0
•••
Patent Citations Received
‌
US Patent 11955393 Structures for bonding elements including conductive interface features
0
‌
US Patent 11670615 Bonded structures
0
‌
US Patent 11417576 Seal for microelectronic assembly
0
‌
US Patent 11948847 Bonded structures
0
‌
US Patent 11600542 Cavity packages
Patent Inventor Names
Shaowu Huang
0
Guilian Gao
0
Ilyas Mohammed
0
Liang Wang
0
Rajesh Katkar
0
Cyprian Emeka Uzoh
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
11257727
Patent Primary Examiner
‌
Eduardo A Rodela

Find more entities like US Patent 11257727 Seal for microelectronic assembly

Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
Open Query Tool
Access by API
Golden Query Tool
Golden logo