US Patent 11270936 Integrated circuit including supervia and method of making

An integrated circuit includes a substrate and a first conductive line extending in a first direction parallel to a top surface of the substrate, wherein the first conductive line is a first distance from the top surface of the substrate. The integrated circuit further includes a second conductive line extending in a second direction parallel to the top surface of the substrate, wherein the second conductive line is a second distance from the top surface of the substrate, and the second distance is greater than the first distance. The integrated circuit further includes a third conductive line extending in the first direction, wherein the second conductive line is a third distance from the top surface of the substrate, and the third distance is greater than the second distance. The integrated circuit further includes a supervia directly connected to the first conductive line and the third conductive line.