US Patent 11279118 Packaging film for high temperature materials
Patent 11279118 was granted and assigned to Bemis Company on March, 2022 by the United States Patent and Trademark Office.
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Patent Number
112791180
Date of Patent
March 22, 2022
0Patent Application Number
167585810
Date Filed
October 31, 2017
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Patent Citations Received
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Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
112791180
Date of Patent
March 22, 2022
0Patent Application Number
167585810
Date Filed
October 31, 2017
0Official Website
Patent Primary Examiner
CPC Code
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US Patent 11279118 Packaging film for high temperature materials
Article
A packaging film is described. The packaging film comprises an exterior layer comprising a first polyolefin having a density of less than or equal to 0.925 g/cm
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Is a
Patent applicant
Current assignee
Patent jurisdiction
Patent number
11279118
Date of patent
March 22, 2022
Patent application number
16758581
Date Filed
October 31, 2017
Patent primary examiner
CPC Code
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