US Patent 11279118 Packaging film for high temperature materials
Patent 11279118 was granted and assigned to Bemis Company on March, 2022 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
October 31, 2017
Date of Patent
March 22, 2022
Patent Applicant
Patent Application Number
16758581
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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