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US Patent 11289372 3D IC method and device

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Edits on 22 May, 2023
"Remove website redirecting to Patent Public Search front page"
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Golden AI
edited on 22 May, 2023
Edits made to:
Infobox (-1 properties)
Infobox
Official Website
https://pdfpiw.uspto.gov/.piw?Docid=1128937200
Edits on 29 Apr, 2023
"update citations for inverse infoboxes"
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Golden AI
edited on 29 Apr, 2023
Edits on 26 Apr, 2023
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edited on 26 Apr, 2023
Edits on 23 Apr, 2023
"update citations for inverse infoboxes"
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edited on 23 Apr, 2023
Edits on 7 Apr, 2023
"update citations for inverse infoboxes"
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edited on 7 Apr, 2023
Edits on 3 Apr, 2023
"Entity importer update"
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edited on 3 Apr, 2023
Infobox
Is a
Patent
Patent
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
0
Patent Number
112893720
Date of Patent
March 29, 2022
0
Patent Application Number
173308950
Date Filed
May 26, 2021
0
Official Website
https://pdfpiw.uspto.gov/.piw?Docid=112893720
Patent Citations
‌
US Patent 10002844 Bonded structures
0
‌
US Patent 10026605 Method of reducing residual contamination in singulated semiconductor die
0
‌
US Patent 10075657 Edgeless large area camera system
0
‌
US Patent 10147641 3D IC method and device
0
‌
US Patent 10204893 Stacked dies and methods for forming bonded structures
0
‌
US Patent 10224241 Copper interconnect structure with manganese oxide barrier layer
0
‌
US Patent 10269756 Die processing
0
‌
US Patent 10276619 Semiconductor device structure with a conductive feature passing through a passivation layer
0
‌
US Patent 10276909 Structure comprising at least a first element bonded to a carrier having a closed metallic channel waveguide formed therein
0
‌
US Patent 10325806 Copper interconnect structure with manganese oxide barrier layer
0
‌
US Patent 10446456 Integrated circuits protected by substrates with cavities, and methods of manufacture
0
‌
US Patent 11011418 3D IC method and device
0
‌
US Patent 11069734 Image sensor device
0
Patent Citations Received
‌
US Patent 11515202 3D IC method and device
0
Patent Primary Examiner
‌
Nathan W Ha
0
CPC Code
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H01L 27/0688
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H01L 25/50
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H01L 25/0657
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H01L 24/97
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H01L 24/94
0
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H01L 24/81
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H01L 24/02
0
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H01L 23/481
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H01L 21/76898
0
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H01L 21/76838
0
Edits on 31 Mar, 2023
"update citations for inverse infoboxes"
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Golden AI
edited on 31 Mar, 2023
Edits on 24 Mar, 2023
"update citations for inverse infoboxes"
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Golden AI
edited on 24 Mar, 2023
Edits on 22 Mar, 2023
"update citations for inverse infoboxes"
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Golden AI
edited on 22 Mar, 2023
Edits on 20 Mar, 2023
"update citations for inverse infoboxes"
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Golden AI
edited on 20 Mar, 2023
Edits on 30 Nov, 2022
"update inverses"
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Golden AI
edited on 30 Nov, 2022
Edits made to:
Infobox (+1 properties)
Infobox
Patent Citations Received
‌
US Patent 11515202 3D IC method and device
0
Edits on 6 Oct, 2022
"update citations for inverse infoboxes"
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Golden AI
edited on 6 Oct, 2022
Edits on 28 Sep, 2022
"update citations for inverse infoboxes"
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Golden AI
edited on 28 Sep, 2022
Edits on 27 Sep, 2022
"update citations for inverse infoboxes"
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Golden AI
edited on 27 Sep, 2022
Edits on 26 Sep, 2022
"update citations for inverse infoboxes"
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Golden AI
edited on 26 Sep, 2022
Edits on 25 Sep, 2022
"update citations for inverse infoboxes"
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Golden AI
edited on 25 Sep, 2022
"update citations for inverse infoboxes"
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Golden AI
edited on 25 Sep, 2022
"update citations for inverse infoboxes"
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Golden AI
edited on 25 Sep, 2022
Infobox
Patent Citations
‌
US Patent 10269756 Die processing
0
Edits on 23 Sep, 2022
"Entity importer update"
Golden AI profile picture
Golden AI
edited on 23 Sep, 2022
Infobox
Is a
Patent
Patent
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
0
Patent Number
112893720
Date of Patent
March 29, 2022
0
Patent Application Number
173308950
Date Filed
May 26, 2021
0
Official Website
https://pdfpiw.uspto.gov/.piw?Docid=112893720
Patent Citations
‌
US Patent 10002844 Bonded structures
0
‌
US Patent 10026605 Method of reducing residual contamination in singulated semiconductor die
0
‌
US Patent 10075657 Edgeless large area camera system
0
‌
US Patent 10147641 3D IC method and device
0
‌
US Patent 10204893 Stacked dies and methods for forming bonded structures
0
‌
US Patent 10224241 Copper interconnect structure with manganese oxide barrier layer
0
‌
US Patent 10269756 Die processing
0
‌
US Patent 10276619 Semiconductor device structure with a conductive feature passing through a passivation layer
0
‌
US Patent 10276909 Structure comprising at least a first element bonded to a carrier having a closed metallic channel waveguide formed therein
0
‌
US Patent 10325806 Copper interconnect structure with manganese oxide barrier layer
0
‌
US Patent 10446456 Integrated circuits protected by substrates with cavities, and methods of manufacture
0
‌
US Patent 11011418 3D IC method and device
0
‌
US Patent 11069734 Image sensor device
0
Patent Primary Examiner
‌
Nathan W Ha
0
CPC Code
‌
H01L 27/0688
0
‌
H01L 25/50
0
‌
H01L 25/0657
0
‌
H01L 24/97
0
‌
H01L 24/94
0
‌
H01L 24/81
0
‌
H01L 24/02
0
‌
H01L 23/481
0
‌
H01L 21/76898
0
‌
H01L 21/76838
0
"update citations for inverse infoboxes"
Golden AI profile picture
Golden AI
edited on 23 Sep, 2022

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