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US Patent 11309383 Quad-layer high-k for metal-insulator-metal capacitors
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Patent
Date Filed
December 15, 2020
Date of Patent
April 19, 2022
Patent Application Number
17122004
Patent Citations
US Patent 10229873 Three plate MIM capacitor via integrity verification
Patent Citations Received
US Patent 11404379 Structure and method for bridge chip assembly with capillary underfill
Patent Jurisdiction
United States Patent and Trademark Office
Patent Number
11309383
Patent Primary Examiner
Jose R Diaz
CPC Code
H01L 28/60
H01L 21/022
H01L 28/91
H01L 21/02181
H01L 21/02178
H01L 28/40
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