Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
June 7, 2022
Patent Application Number
17106402
Date Filed
November 30, 2020
Patent Citations
Patent Citations Received
Patent Primary Examiner
A receiving means for receiving and mounting of wafers, comprised of a mounting surface, mounting means for mounting a wafer onto the mounting surface and compensation means for active, locally controllable, compensation of local and/or global distortions of the wafer.
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