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US Patent 11373950 Advanced lithography and self-assembled devices
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Patent
Current Assignee
Intel
Date Filed
December 2, 2020
Date of Patent
June 28, 2022
Patent Applicant
Intel
Patent Application Number
17110215
Patent Citations
US Patent 10014256 Unidirectional metal on layer with ebeam
US Patent 10153270 Electrostatic discharge protection devices
US Patent 10211088 Self-aligned isotropic etch of pre-formed vias and plugs for back end of line (BEOL) interconnects
US Patent 10269623 Image tone-reversal with a dielectric using bottom-up cross-linking for back end of line (BEOL) interconnects
Patent Jurisdiction
United States Patent and Trademark Office
Patent Number
11373950
Patent Primary Examiner
Karen Kusumakar
CPC Code
H01L 23/53238
H01L 23/5329
H01L 27/0886
H01L 29/7848
H01L 29/66545
H01L 21/76801
H01L 21/76807
H01L 21/76808
H01L 21/76811
H01L 21/7682
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