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US Patent 11380616 Fan out package-on-package with adhesive die attach
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Patent
Current Assignee
Intel
Date Filed
May 16, 2018
Date of Patent
July 5, 2022
Patent Applicant
Intel
Patent Application Number
15981830
Patent Citations
US Patent 11049802 Semiconductor device and method of manufacture
US Patent 10269589 Method of manufacturing a release film as isolation film in package
US Patent 10269773 Semiconductor packages and methods of forming the same
US Patent 10276404 Integrated fan-out package
US Patent 10347574 Integrated fan-out packages
US Patent 10515901 InFO-POP structures with TIVs having cavities
US Patent 10573589 Semiconductor package
US Patent 11031328 Semiconductor package
US Patent 11031345 Integrated circuit package and method of forming same
US Patent 10529697 Package structure and method of forming the same
Patent Jurisdiction
United States Patent and Trademark Office
Patent Number
11380616
Patent Primary Examiner
Victor A. Mandala, Jr.
CPC Code
H01L 2225/1041
H01L 25/03
H01L 21/561
H01L 23/315
H01L 23/16
H01L 23/3135
H01L 23/3128
H01L 2924/181
H01L 2224/16225
H01L 2224/18
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