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US Patent 11387202 Nanowire bonding interconnect for fine-pitch microelectronics

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
Date Filed
January 29, 2020
Date of Patent
July 12, 2022
Patent Application Number
16776182
Patent Citations Received
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US Patent 12125784 Interconnect structures
0
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US Patent 11694925 Diffusion barrier collar for interconnects
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US Patent 11756880 Interconnect structures
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US Patent 11790219 Three dimensional circuit implementing machine trained network
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US Patent 11978724 Diffused bitline replacement in memory
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US Patent 12015003 High density interconnection and wiring layers, package structures, and integration methods
0
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US Patent 12068278 Processed stacked dies
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US Patent 12074092 Hard IP blocks with physically bidirectional passageways
0
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US Patent 12113054 Non-volatile dynamic random access memory
0
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US Patent 12113056 Stacked dies and methods for forming bonded structures
0
•••
Patent Inventor Names
Ilyas Mohammed
0
Belgacem Haba
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
11387202
Patent Primary Examiner
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Amar Movva
CPC Code
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H01L 2224/04042
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H01L 2224/05005
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H01L 2224/46
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H01L 2224/45028
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H01L 2224/0801

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