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US Patent 11594470 Modular microjet cooling of packaged electronic components

Overview Structured Data Issues Contributors Activity

Is a

Date Filed

April 26, 2021

Date of Patent

February 28, 2023

Patent Applicant

Massachusetts Institute of Technology

Patent Application Number

17240162

Patent Citations

US Patent 10665530 Micro heat transfer arrays, micro cold plates, and thermal management systems for cooling semiconductor devices, and methods for using and making such arrays, plates, and systems

US Patent 10903141 Thermal management of RF devices using embedded microjet arrays

US Patent 11018077 Modular microjet cooling of packaged electronic components

US Patent 10957624 Micro heat transfer arrays, micro cold plates, and thermal management systems for cooling semiconductor devices, and methods for using and making such arrays, plates, and systems

US Patent 10096537 Thermal management systems, methods for making, and methods for using

US Patent 10306802 Micro jet impingement heat sink

US Patent 10651112 Thermal management of RF devices using embedded microjet arrays

US Patent 10665529 Modular microjet cooling of packaged electronic components

Patent Citations Received

US Patent 11844193 Direct contact fluid based cooling module

0

US Patent 11963341 High temperature electronic device thermal management system

0

US Patent 12016157 Actively cooled heat-dissipation lids for computer processors and assemblies

0

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

Patent Primary Examiner

Adam B Dravininkas

CPC Code

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