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US Patent 11646198 Ultrathin atomic layer deposition film accuracy thickness control

Patent 11646198 was granted and assigned to Lam Research on May, 2023 by the United States Patent and Trademark Office.

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Current Assignee

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Patent Jurisdiction

United States Patent and Trademark Office

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Patent Number

Patent Inventor Names

Seiji Matsuyama0

Adrien LaVoie0

Hu Kang0

Jun Qian0

Purushottam Kumar0

Date of Patent

May 9, 2023

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Patent Application Number

173059380

Date Filed

July 16, 2021

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Patent Citations

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US Patent 10741458 Methods for depositing films on sensitive substrates

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US Patent 11101129 Ultrathin atomic layer deposition film accuracy thickness control

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Methods for depositing films by atomic layer deposition using aminosilanes are provided.

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