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US Patent 11664213 Bevel edge removal methods, tools, and systems
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Patent
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Current Assignee
Taiwan Semiconductor Manufacturing Company
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Date Filed
December 26, 2019
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Date of Patent
May 30, 2023
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Patent Applicant
Taiwan Semiconductor Manufacturing Company
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Patent Application Number
16727533
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Patent Citations
US Patent 9146469 Middle layer composition for trilayer patterning stack
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US Patent 9213234 Photosensitive material and method of lithography
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US Patent 9223220 Photo resist baking in lithography process
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US Patent 9256133 Apparatus and method for developing process
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US Patent 9548303 FinFET devices with unique fin shape and the fabrication thereof
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US Patent 10857649 Method and apparatus for performing a polishing process in semiconductor fabrication
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US Patent 10073347 Semiconductor method of protecting wafer from bevel contamination
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US Patent 7979942 Substrate treatment apparatus and substrate treatment method
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US Patent 8020240 Substrate treatment apparatus
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US Patent 8796666 MOS devices with strain buffer layer and methods of forming the same
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•••
Patent Jurisdiction
United States Patent and Trademark Office
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Patent Number
11664213
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Patent Primary Examiner
Alexander Markoff
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CPC Code
H01L 21/67219
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H01L 21/67046
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H01L 21/304
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H01L 21/30625
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A46B 13/04
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A46B 2200/30
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B08B 1/002
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H01L 21/02087
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B08B 3/08
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B08B 5/04
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•••
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