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US Patent 11676880 High thermal conductivity vias by additive processing

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
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Current Assignee
Texas Instruments
Texas Instruments
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Date Filed
November 26, 2016
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Date of Patent
June 13, 2023
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Patent Applicant
Texas Instruments
Texas Instruments
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Patent Application Number
15361399
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Patent Citations
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US Patent 7345364 Structure and method for improved heat conduction for semiconductor devices
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US Patent 7473633 Method for making integrated circuit chip having carbon nanotube composite interconnection vias
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US Patent 7560310 Semiconductor constructions and semiconductor device fabrication methods
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US Patent 7572680 Packaged integrated circuit with enhanced thermal dissipation
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US Patent 7586191 Integrated circuit apparatus with heat spreader
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US Patent 7633152 Heat dissipation in integrated circuits
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US Patent 7642641 Integrated circuit component with passivation layer
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US Patent 7763973 Integrated heat sink for a microchip
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US Patent 7768121 Apparatus and methods for cooling semiconductor integrated circuit package structures
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US Patent 7189778 Thermally conductive polymer molded article and method for producing the same
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•••
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
11676880
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Patent Primary Examiner
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Caleb E Henry
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CPC Code
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H01L 21/4882
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H01L 21/76801
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H01L 21/76877
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H01L 23/3733
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H01L 23/5226
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H01L 24/05
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H01L 24/06
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H01L 21/76879
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H01L 23/367
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H01L 23/522
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•••

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