US Patent 11676957 Integrated circuit device, system and method
Patent 11676957 was granted and assigned to Taiwan Semiconductor Manufacturing Company on June, 2023 by the United States Patent and Trademark Office.
All edits
Edits on 20 Jun, 2024
Golden AI
Edits made to:
Infobox (+1 properties)
Infobox
Patent Citations Received
Edits on 14 Jun, 2023
Golden AI
Edits made to:
Infobox (+16 properties)
Article (+576 characters)
US Patent 11676957 Integrated circuit device, system and method
Article
An integrated circuit (IC) device includes a substrate having opposite first and second sides, an active region over the first side of the substrate, a first conductive pattern over the active region, and a second conductive pattern under the second side of the substrate. The active region includes a first portion and a second portion. The first conductive pattern is electrically coupled to the first portion and the second portion of the active region. The second conductive pattern is electrically coupled to the first portion and the second portion of the active region.
Infobox
Is a
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
116769570
Date of Patent
June 13, 2023
0Patent Application Number
171899080
Date Filed
March 2, 2021
0Patent Citations
Patent Primary Examiner
Find more entities like US Patent 11676957 Integrated circuit device, system and method
Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
