Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
June 27, 2023
0Patent Application Number
175809610
Date Filed
January 21, 2022
0Patent Citations
Patent Primary Examiner
An integrated circuit package and a system including the integrated circuit package as well as a process for assembling the integrated circuit package are provided to improve integrated circuit power delivery. The integrated circuit package includes a first die having a plurality of pads formed in the first die and exposed on a top surface of the first die, at least one post on the first die, and a substrate including one or more redistribution layers. Each post in the at least one post spans at least two pads on the first die utilized for power distribution, and the first die is connected to the substrate via the at least one post.
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